Raj Saini , MSc

Advanced Workflow Specialist UK, Leica Microsystems

MSc Semiconductor Devices-Lancaster University (Brunel, Applied Physics)

Career:

TI; Chip layout
Fab (photolithography-Process Engineer)
BioRad; Overlay Metrology System (photolith-Applications Engineer)
KLA-Tencor; Metrology and Low-voltage SEM (photolith-Senior Applications Engineer)
NVS; Process Control Software for Photolith (Applications Manager, Project Manager)
Malvern Instruments: Analysers (Optical, Raman, NIR: Service Specialist)
Leica Microsystems (Advanced Workflow Specialist)

Region of a patterned wafer inspected using optical microscopy and automated and reproducible DIC (differential interference contrast). With DIC users are able to visualize small height differences on the wafer surface more easily.

6 英寸晶片检测显微镜，可靠的观察微小高度差

本文介绍了一种 6 英寸晶圆检测显微镜，无论用户的技术水平如何，它都能自动进行可重复的 DIC（微分干涉对比）成像。集成电路 (IC) 芯片和半导体元件的制造需要晶圆检测，以确保不存在影响性能的缺陷。通常使用光学显微镜进行质量控制、故障分析和 R&D 检测。为了有效地观察晶圆上结构之间的微小高度差，可以使用 DIC。