![[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest. IC_chip_cross_section.jpg](/fileadmin/_processed_/a/c/csm_IC_chip_cross_section_4b23e637c7.jpg "[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.")
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![[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.](/fileadmin/_processed_/9/1/csm_Processed_wafer_standard_and_oblique_brightfield_illumination_5f0e4f9174.jpg "[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illuminati")
