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半导体晶圆加工、集成电路封装、集成电路组装和测试

徕卡显微系统公司的定制化、模块化成像解决方案可帮助供应商和设备制造商在晶圆加工、集成电路封装、集成电路组装和测试中快速而精确地进行检测和分析。 证明在半导体器件制造过程中符合既定规范对于确保可靠性至关重要。 为了证明已达到生产优质半导体器件所要求的洁净度和最低缺陷率，准确的图像记录必不可少。 但是，对尖端、高性能技术的开发需求是源源不断的，因此这些成像系统也预计会对研发起到促进作用。

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请与我们联系，获得有关半导体晶圆加工和集成电路封装应用中显微镜解决方案的专家建议。

观察纳米级细节的快速高分辨率成像

我们的成像系统可以准确而快速地检测和分析晶圆的表面，帮助确保您制造的半导体器件发挥最佳性能。 但是，进行表面计量时可能会遇到以下关键挑战： 晶圆表面可能具有高坡度的复杂结构，需要出色的横向分辨率，或者有微小的峰谷起伏，需要亚纳米级垂直分辨率。 利用共聚焦显微成像和干涉模式成像的徕卡成像系统可以为您提供高横向分辨率（最小140纳米）和垂直分辨率（最小0.1纳米），并且可以快速采集图像（以秒计）。

共聚焦显微镜三维成像显示晶圆片表面又高又窄的突起物。具有复杂形状或陡峭倾斜的地表特征，比如这个突起，可以用高分辨率快速成像。1:表面有凸点的晶圆2:共聚焦显微镜扫描凸点3:最终图像

半导体晶圆加工、集成电路封装与组件产品 5

[Translate to chinese:] Flexacam C3

Flexacam C3

1200万像素显微镜摄像头——简洁、色彩准确、实时协作
Microscope Camera K3C & K3M

K3C & K3M

用于生命科学和工业的成像应用和分析

Leica DM2700 M正置金相显微镜

LED照明技术全面应用于明场，暗场，微分相差干涉，偏光或荧光观察模式，一体化内置式倾斜照明最大程度的提高了表面形貌和缺陷的可视化效果
产品档案

For very smooth wafer surfaces, interferometric imaging can acquire surface textures with a resolution down to 0.1 nm. The entire scan took less than 3 seconds.

Contrast methods: Images of part of a wafer: a) quick surface overview followed by detection of b) particles with brightfield, c) micro-scratches with darkfield, and d) defects on transparent films with differential interference contrast (DIC). Imaging with each illumination mode is completed in seconds.

View more with less effort, diverse contrast methods and top-notch optics

Our imaging systems allow you to visualize difficult-to-image wafer features more easily to achieve more efficient and accurate wafer inspection and quality control. The image quality in terms of contrast and level of detail easily seen depends strongly on the lighting and optics used.

So choosing the appropriate lighting contrast method and using maximally corrected, high performance optics is imperative. Different wafer and device features, e.g., coatings, contamination, scratches, and defects, are more enhanced with one lighting contrast method compared to another.

High Performance Optics

High quality optics can make your wafer and semiconductor device inspection work more efficient, because you will see the fine details clearly with less effort. Leica Microsystems’ imaging systems use top-performing, award-winning optics which produce distortion free images. Optics can suffer from 2 types of aberration which require correction:

  • monochromatic (independent of the light’s wavelength [color]), such as astigmatism, coma, and field curvature
  • chromatic (dependent on the light’s wavelength).

Our optical designers and engineers provide optics which enable you to inspect wafers and devices with optimal contrast and resolution.

环形光下晶圆图像
同轴光下晶圆图像
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