Thomas Pfeifer

Advanced Workflow Specialist

Before becoming an AWS in January 2020, Thomas worked for 10 years as a Project manager in the R&D department of Leica´s Nanotechnology division. Before joining Leica, he worked as an Application Specialist for Bal-Tec. Thomas holds a degree in Physics from the Technical University of Chemnitz, where he worked as a Research Assistant to the Chair of Physics of Solid Bodies.

Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

横截面切片法分析IC芯片的结构与化学成分

从本文中了解如何通过横截面分析法对集成电路 (IC) 芯片等电子元件进行有效的结构和元素分析。探索如何通过研磨系统进行铣削、锯切、磨削和抛光工艺以及用于同时进行目视检测和化学分析的二合一解决方案来完成的。可针对电子行业的各种工作流程和应用实现快速、详细的材料分析，包括竞争分析、质量控制 (QC)、故障分析 (FA) 以及研发 (R&D)。