![[Translate to chinese:] Wafer Wafer.jpg](/fileadmin/_processed_/8/8/csm_Wafer_ac13ab1fa0.jpg "[Translate to chinese:] Wafer")
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![[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.](/fileadmin/_processed_/9/1/csm_Processed_wafer_standard_and_oblique_brightfield_illumination_5f0e4f9174.jpg "[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illuminati")
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![[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.](/fileadmin/_processed_/a/c/csm_IC_chip_cross_section_b2bf8f2497.jpg "[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.")
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利用数码显微镜快速、可靠地对印刷电路板（PCB）及其总成（PCBA）进行显微观察
本文阐释了徕卡数码显微镜DVM6的性能优势，例如简单直观的操作系统、快速简单的放大倍率切换方式，并且可以通过编码准确调取参数。
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