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![[Translate to chinese:] Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.](/fileadmin/_processed_/3/b/csm_Grinding_polishing_EM_TXP_91d5c1584d.jpg "[Translate to chinese:] Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.")
电子产品制造截面分析
本文将讨论印刷电路板 (PCB) 和总成 (PCBA)、集成电路 (IC) 和电池组件的横截面为什么对质量控制 (QC)、故障分析 (FA) 和研发 (R&D) 有效，以及如何制备这些横截面。
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![[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.](/fileadmin/_processed_/a/c/csm_IC_chip_cross_section_20a5502a5d.jpg "[Translate to chinese:] Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.")
横截面切片法分析IC芯片的结构与化学成分
从本文中了解如何通过横截面分析法对集成电路 (IC) 芯片等电子元件进行有效的结构和元素分析。探索如何通过研磨系统进行铣削、锯切、磨削和抛光工艺以及用于同时进行目视检测和化学分析的二合一解决方案来完成的。可针对电子行业的各种工作流程和应用实现快速、详细的材料分析，包括竞争分析、质量控制 (QC)、故障分析 (FA) 以及研发 (R&D)。
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![[Translate to chinese:] EBSD grain size distribution of the cross section of a gold wire within a silicon matrix from inside a CPU (central processing unit of a computer). The grains are highlighted with arbitrary colors.](/fileadmin/_processed_/d/0/csm_EBSD_grain_size_distribution_of_the_cross_section_of_a_gold_wire_58f1fb038c.jpg "[Translate to chinese:] EBSD grain size distribution of the cross section of a gold wire within a silicon matrix from inside a CPU (central processing unit of a computer). The grains are highlighted with arbitrary colors.")
非聚焦离子束研磨制备高质量EBSD样品
背散射电子衍射技术（EBSD）能在样本表面上方数十纳米处生成电子衍射，因而它又称为一种“表面”技术。采用这种方法生成EBSD图案时，样本表面不会遭受任何损坏。本文中，我们介绍了使用EBSD高效抛光两个通过非聚焦离子束研磨制备的高难度样本的案例。
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![[Translate to chinese:] SEM image of the full Li-NMC electrode sample, showing the two porous layers and the metal film at the center of the structure.](/fileadmin/_processed_/2/f/csm_Cross_Section_Ion_Beam_Milling_of_Battery_Components_teaser_5295ac1cbc.jpg "[Translate to chinese:] SEM image of the full Li-NMC electrode sample, showing the two porous layers and the metal film at the center of the structure.")
电池组件的横截面离子束研磨（锂电池与铅酸电池栅板）
深入了解锂电池系统需要高质量的表面处理，以评估其内部结构和形态。然而，快速简单地制备原始横截面可能由于所涉及材料的性质和电池结构而变得困难。多数材料系统通常使用切割、包埋、研磨、抛光等纯机械方法制备横截面。在这种情况下，单纯的机械制备不足以对电池进行高分辨率的SEM分析。
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![[Translate to chinese:] 3D reconstruction of an intercellular bridge in a C. elegans embryo](/fileadmin/_processed_/0/9/csm_cryo-workflow-lp-mz_d30fabea6b.jpg "[Translate to chinese:] 3D reconstruction of an intercellular bridge in a C. elegans embryo")
下载 EM 工作流程解决方案手册
这本 26 页的工作流程手册中讨论的解决方案已被证明能够提供快速、可靠和可重复的结果。如果您对自己的工作流程有特殊要求，或对此处显示的主题有任何疑问，我们的徕卡专家将随时乐意为您提供帮助。
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Exploring the Structure and Life Cycle of Viruses
The SARS-CoV-2 outbreak started in late December 2019 and has since reached a global pandemic, leading to a worldwide battle against COVID-19. The ever-evolving electron microscopy methods offer a…
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Application Booklet for EM TIC 3X
Today, ion beam milling is one of the most widely-used methods for preparing samples for electron microscopy. Download this 76-pages booklet today and learn how to improve your processes.
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Workflows and Instrumentation for Cryo-electron Microscopy
Cryo-electron microscopy is an increasingly popular modality to study the structures of macromolecular complexes and has enabled numerous new insights in cell biology. In recent years, cryo-electron…
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EM TIC 3X进行离子束刻蚀简介
在这篇文章中，您可以了解到如何通过使用EM TIC 3X离子束研磨仪的离子束蚀刻工艺来优化样品的制备质量。文中简介了EM TIC 3X仪器特性，以此解释如何灵活地将该设备应用于各类研究领域的样本制备工作中。本文将帮助读者了解离子束刻蚀工艺的基本原理，及其如何在各种应用中获得高分辨率的SEM图像。本文也将介绍EM TIC…