![[Translate to chinese:] User analyzing particles and fibers on a filter for cleanliness analysis with the DM6 M LIBS 2-methods-in-1 solution. 3rd_Analyzer_Package_Leica_DM6M_LIBS.jpg](/fileadmin/_processed_/7/2/csm_3rd_Analyzer_Package_Leica_DM6M_LIBS_9c9e3d9e54.jpg "[Translate to chinese:] User analyzing particles and fibers on a filter for cleanliness analysis with the DM6 M LIBS 2-methods-in-1 solution.")
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![[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.](/fileadmin/_processed_/9/1/csm_Processed_wafer_standard_and_oblique_brightfield_illumination_5f0e4f9174.jpg "[Translate to chinese:] Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illuminati")
